Project title: Development of material card for numerical modelling of System-in-Package behaviour
Acronym: SiPinSpace
Type of project: International Project
Role: Contractor
Financing: European Space Agency ESA
Duration: 1.10.2026 – 31.12.2027
Laboratories: Laboratory for Numerical Modelling and Simulation LNMS and Laboratory for Experimental Mechanics LEM
Project description:
Modern System-in-Package (SiP) microelectronic systems combine several different materials within a highly compact structure. During manufacturing, these materials are exposed to significant temperature changes, epoxy resin curing, and differences in thermal expansion, which can lead to residual stresses and deformation or warpage of the structure. These effects may significantly influence the reliability of electronic components, particularly in demanding space environments.
The aim of the project is to develop an advanced material model for epoxy resins that will enable numerical simulation of their behaviour during curing and subsequent operation. The model will be experimentally characterised and implemented in the ABAQUS software environment as a user-defined material subroutine (UMAT). This will enable more accurate prediction of viscoelastic behaviour, chemical shrinkage, residual stresses and warpage in SiP structures.
The project is led by the University of Ljubljana, Faculty of Mechanical Engineering, with Thales Alenia Space France participating as the industrial partner and end user of the developed numerical tool. Experimental material characterisation and numerical model development will be carried out in parallel at the Faculty of Mechanical Engineering, while the resulting tool will subsequently be validated on a representative SiP structure and tested on realistic industrial cases.
